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NP70N04MUG
MARKING INFORMATION
NEC
70N04
UG
Pb-free plating marking
Abbreviation of part number
Lot code
RECOMMENDED SOLDERING CONDITIONS
The NP70N04MUG should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Wave soldering
MP-25K
Partial heating
MP-25K
Soldering Conditions
Maximum temperature (Solder temperature): 260 ° C or below
Time: 10 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Maximum temperature (Pin temperature): 350 ° C or below
Time (per side of the device): 3 seconds or less
Recommended
Condition Symbol
THDWS
P350
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet D18664EJ4V0DS
7
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